300mm IIIV on SOI laser integration process, fabrication and prototyping

The fabrication of SOI integrated IIIV lasers using a full 300mm CMOS foundry flow is reported. After SOI fabrication, IIIV Wafers are bonded then processed with CMOS compatible planar BEOL. The lasers are tested, exhibiting around 70mA threshold, 30dB SMSR with mW range output power.

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Publication Details

Published
2025-04-14
DOI
https://doi.org/10.1109/siphotonics64386.2025.10985732
Citations
1
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
Field-Weighted Citation Impact
0.73
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300mm IIIV on SOI laser integration process, fabrication and prototyping

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300mm IIIV on SOI laser integration process, fabrication and prototyping

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article en
1 citations

Abstract

The fabrication of SOI integrated IIIV lasers using a full 300mm CMOS foundry flow is reported. After SOI fabrication, IIIV Wafers are bonded then processed with CMOS compatible planar BEOL. The lasers are tested, exhibiting around 70mA threshold, 30dB SMSR with mW range output power.

Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR), Laboratoire d'Électronique des Technologies de l'Information (FR), Université Grenoble Alpes (FR)
Affordable and clean energy
Openalex Percentile: Top 29%
Integrated Circuits and Semiconductor Failure Analysis
0.73
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