Root cause analysis to predict the die cracks in the multichip package

The development of densely packed multi-chip packages involves numerous processes, making them susceptible to mechanical and electrical failures, specifically with overhanging dies. The encapsulated package with visible surface defects is taken for the study to understand the root cause of the defects. Decapsulation of packages have visible die cracks and simulations are performed to understand the effect of the package development processes. One of probable failure mode of fluid structure interaction (FSI) during encapsulation is simulated and understood the effect of mold flow on the overhang. Another process of wire bonding is simulated to understand the effect of wire bonding process induces stresses on overhang die. It is observed that wire bonding induced stresses are higher when compared with FSI induced stresses due to mold flow, which might lead to die cracks.