Radiated Emission Behavioral Modeling and Mitigation for Ungrounded Heatsink by VRs Inductor

The intense magnetic field of inductors of voltage regulators (VR) placed near to ungrounded heat sink (HS), can be coupled to the ungrounded heatsink structure, which can cause uninterrupted radiated emissions from the heat sink. One of the methods to reduce these emissions is to connect the heatsink to the PCB using a flexible conductive gasket. Radiated emission behavior modeling is established due to unintentional inductors of high-power rail VRs. To improve emission behavior, HS grounding is modeled with a low-cost viable solution with a gasket. Improve radiated emission behavior is observed after the inclusion of a conductive gasket to ground heat sink with system ground.

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Publication Details

Published
2024-12-17
DOI
https://doi.org/10.1109/edaps64431.2024.10988455
Primary Topic
3D IC and TSV technologies
Type
article
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article

Radiated Emission Behavioral Modeling and Mitigation for Ungrounded Heatsink by VRs Inductor

Rajiv Panigrahi, Rajendra Vrukshavai, S P. Shyju, Shashidhara Shivakumara
3D IC and TSV technologies
article

Radiated Emission Behavioral Modeling and Mitigation for Ungrounded Heatsink by VRs Inductor

Rajiv Panigrahi, Rajendra Vrukshavai, S P. Shyju, Shashidhara Shivakumara
article en

Abstract

The intense magnetic field of inductors of voltage regulators (VR) placed near to ungrounded heat sink (HS), can be coupled to the ungrounded heatsink structure, which can cause uninterrupted radiated emissions from the heat sink. One of the methods to reduce these emissions is to connect the heatsink to the PCB using a flexible conductive gasket. Radiated emission behavior modeling is established due to unintentional inductors of high-power rail VRs. To improve emission behavior, HS grounding is modeled with a low-cost viable solution with a gasket. Improve radiated emission behavior is observed after the inclusion of a conductive gasket to ground heat sink with system ground.

Intel (India) (IN)
Climate action
Openalex Percentile: Top 72%
3D IC and TSV technologies
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