Signal Integrity Analysis of Ultra-scaled Copper-Graphene Heterogeneous Interconnect Structure

In this paper, a novel copper graphene heterogeneous interconnect structure is proposed that retains the ease of fabrication while offering significantly improved performance. Signal integrity analysis is performed considering insertion loss and eye diagram. The electrical performance of the proposed hetero interconnects is found to be better than the conventional copper interconnects, making these nano-interconnects suitable for back end of line (BEOL) applications.