Signal-Integrity Assurance in HBM Links with Temperature-Dependent Interconnections

On account of the temperature dependency, the signal integrity of HBM links is assessed by the Peak Distortion Analysis. An efficient worst-bit scheme solves for parametric designs of the traces to assure the eye-diagram margins.

Authors

Ruey‐Beei Wu (ORCID: https://orcid.org/0000-0001-5735-2152)
Jui-Fen Chien (ORCID: https://orcid.org/0009-0009-4538-5075)
Chien-Min Lin (ORCID: https://orcid.org/0009-0003-0913-1090)

Institutions

National Taiwan University (TW)

Publication Details

Published: 2024-12-17
DOI: https://doi.org/10.1109/edaps64431.2024.10988453
Citations: 2
Primary Topic: 3D IC and TSV technologies
Type: article
Field-Weighted Citation Impact: 0.42

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article

Signal-Integrity Assurance in HBM Links with Temperature-Dependent Interconnections

Ruey‐Beei Wu, Jui-Fen Chien, Chien-Min Lin

Dec 17, 2024

2 citations

3D IC and TSV technologies

0.42

article

Signal-Integrity Assurance in HBM Links with Temperature-Dependent Interconnections

Ruey‐Beei Wu, Jui-Fen Chien, Chien-Min Lin

December 17, 2024article en

2 citations

Abstract

National Taiwan University (TW)

Climate action

Openalex Percentile: Top 35%

3D IC and TSV technologies

0.42

DOI Source OpenAlex

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Signal-Integrity Assurance in HBM Links with Temperature-Dependent Interconnections — Ruey‐Beei Wu, Jui-Fen Chien, et al. · (2024) | TGRS Research Map | TGRS