OPTIMIZATION OF METHODS FOR FORMING Cu-C COATINGS FOR ELECTRICAL ENGINEERING APPLICATIONS

Based on Raman scattering spectra, a comparative analysis and optimization of methods for forming copper-carbon (Cu-C) coatings for the production of solid and electrically conductive composite materials were conducted. Specifically, arc evaporation methods (in both continuous and pulsed modes, as well as their simultaneous use) and high-power pulsed magnetron sputtering were studied. It was noted that varying the discharge parameters in each of these methods allows for the modification of the structural-phase composition of the carbon matrix, namely, the ratio of sp²- and sp³-hybridized carbon atoms, which ultimately determines the physicochemical properties of the coatings. It was shown that the smallest cluster sizes, whose merging forms carbon particles, are characteristic of coatings deposited by the pulsed evaporation of a composite copper-carbon cathode, with a cluster size of 2.5 nm. The largest carbon cluster sizes were observed for the high-power pulsed magnetron sputtering method at a frequency of 5 kHz, measuring 7.8 nm