An Introduction on the IC Packaging Technology of FOPLP

Based on the advantages of higher output efficiency, higher utilization, higher production, lower cost, no requirement for advanced process, higher device density, improved electrical performance and enhanced thermal management, there are many foreign manufacturers and domestic manufacturers all have developed the fan out panel level packaging (FOPLP) technology in the past ten years. The related technologies including die first & face down for FOPLP technology, die first & face up for FOPLP technology and RDL first for FOPLP technology have been developed. The challenges including die shift, panel warpage, RDL process capability, relayed equipment, and market share also need to be considered for a long time along with the developing of FOPLP technology. During the whole process of FOPLP packaging, organic materials including epoxy molding compound (EMC), dry film, photosensitive polyimide (PSPI) and photoresist (PR) were applied to guarantee the performance of packaged chips.