Simulation analysis and quality modeling research on the adhesive process of wrapping paper joints
As an efficient approximation mathematical model, data-driven model effectively addresses the challenges of high computational costs, low efficiency, and difficulty establishing mechanistic models. This paper proposes a research approach for analyzing the adhesive quality of wrapping paper joints, integrating thermo-mechanical coupling finite element analysis, physical experiments, and data-driven modeling. This approach effectively overcomes the challenges of quantifying adhesion quality and the weak correlation between bonding process parameters. Further, it reveals the relationship between controllable process parameters in packaging equipment and joint adhesive strength, offering valuable feedback for production optimization.
Authors
- Nanyan Shen
- Jing Li (ORCID: https://orcid.org/0000-0003-3698-7102)
- Yufei Li (ORCID: https://orcid.org/0000-0003-2783-6468)
Institutions
- Shanghai University (CN)
Publication Details
- Published
- 2025-05-09
- DOI
- https://doi.org/10.1117/12.3066953
- Primary Topic
- Material Properties and Processing
- Type
- article
- Field-Weighted Citation Impact
- 0.00