Advanced Packaging: Enabling the Future of Moore’s Law

Industry is trending towards more complex integration schemes to address cost and scalability challenges The era of 3D integration and advanced packaging is upon us, but the ecosystem is not ready • There are fundamental design, manufacturing, and enabling challenges that must be addressed Metrology, physical debug, and manufacturing test are underserved and need more focus and investment from industry and academic partners • “if you can’t test it, you don’t have a product”