Non-Metallic 3D-Printed Packages Based on Dielectric Slot Waveguides
In the terahertz domain, 3D printing technologies have demonstrated potential applications for the efficient and flexible design of waveguides. Besides, all-dielectric waveguides have shown high coupling efficiency over a broad bandwidth, but a tapered spike is required for coupling to a hollow waveguide. Notably, dielectric slot waveguides offer low loss through strong field confinement in a low-index material, providing taperless interfacing. By combining the 3D printing technique and the slot waveguide, we propose a novel solution for terahertz waveguide packaging characterized by low loss, reduced cost, and ease of fabrication.
Authors
- Masayuki Fujita (ORCID: https://orcid.org/0000-0003-1772-0891)
- Weijie Gao (ORCID: https://orcid.org/0000-0002-6082-6993)
- Daiki Ichikawa
- Withawat Withayachumnankul (ORCID: https://orcid.org/0000-0003-1155-567X)
- Nguyen H. Ngo (ORCID: https://orcid.org/0000-0002-1280-4765)
- Mingxiang Li (ORCID: https://orcid.org/0000-0003-4583-2874)
Institutions
- The University of Adelaide (AU)
- The University of Osaka (JP)
Publication Details
- Published
- 2024-10-09
- DOI
- https://doi.org/10.1109/cama62287.2024.10986206
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Australia-Japan Foundation
- Japan Science and Technology Corporation
- Core Research for Evolutional Science and Technology