Heterogeneous Integration for Sub-THz Antenna Array with InP-based Power Amplifiers

To achieve sub-THz beamforming using the 300GHz band, we developed heterogeneous integration technologies for an antenna array with InP-based power amplifiers (PAs) with an element pitch of 0.7 wavelength (0.7λ) to reduce grating lobes. The flip-chip mounted PAs demonstrated uniform characteristics regardless of their position in the array (inner or outer) on the developed printed substrate. To our knowledge, this is the first demonstration of a 1 × 4 array of InP-based PAs on a printed substrate with an element pitch of less than 1λ.

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Publication Details

Published
2024-10-09
DOI
https://doi.org/10.1109/cama62287.2024.10986091
Citations
1
Primary Topic
Microwave Engineering and Waveguides
Type
article
Field-Weighted Citation Impact
0.21

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Heterogeneous Integration for Sub-THz Antenna Array with InP-based Power Amplifiers

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article

Heterogeneous Integration for Sub-THz Antenna Array with InP-based Power Amplifiers

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article en
1 citations

Abstract

To achieve sub-THz beamforming using the 300GHz band, we developed heterogeneous integration technologies for an antenna array with InP-based power amplifiers (PAs) with an element pitch of 0.7 wavelength (0.7λ) to reduce grating lobes. The flip-chip mounted PAs demonstrated uniform characteristics regardless of their position in the array (inner or outer) on the developed printed substrate. To our knowledge, this is the first demonstration of a 1 × 4 array of InP-based PAs on a printed substrate with an element pitch of less than 1λ.

Tokyo City University (JP), Fujitsu (Japan) (JP)
Ministry of Internal Affairs and Communications, National Institute of Information and Communications Technology
Affordable and clean energy
Openalex Percentile: Top 43%
Microwave Engineering and Waveguides
0.21
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