Simultaneous multi-point glass processing using diffractive optical element and KrF excimer laser

We have previously used KrF excimer laser to directly process fine through-vias and have achieved the formation of vias with diameter of 15μm in glass thickness of 500μm. In order to achieve high productivity, we used Diffractive Optical Element (DOE) to perform simultaneous multi-point glass processing. In this study, we achieved simultaneous processing of 99 vias using KrF excimer laser and DOE.