Characteristic analysis of chip heat sink based on numerical simulation

The heat dissipation effect of chips directly affects the normal operation of smart devices. Currently, air coolers are commonly used for chip heat sinks, and wing shaped heat sinks are widely used. Select fin type heat sinks as the research object according to actual needs, use ANSYS Fluent software to simulate the heat dissipation scenarios of chips in practical applications, and quickly and accurately obtain the heat dissipation characteristics of chips based on the changes in inlet flow velocity of the chassis, from natural convection to turbulence, the different thermal conductivity of heat sinks, and the different surface emissivity of the chassis and heat sinks, and make corresponding comparisons. Provide important basis for design and development, as well as chip heat dissipation optimization.