GaN-based HEMT featuring AlGaN/p-GaN stacked gate layers and oxidized Ni gate electrode with threshold voltages exceeding 3 V
Abstract To realize a high threshold power transistor on a GaN chip alone, we have developed a GaN-based HEMT featuring AlGaN/p-GaN stacked gate layers and oxidized Ni gate electrodes. Experimental results show the threshold voltage increases with the aluminium composition ratio of the AlGaN gate layer, reaching 3.5 V at 0.20 Al ratio. Additionally, samples with more strongly oxidized Ni gates exhibited an even higher threshold voltage of 5.2 V and very low gate current during on-state. These results suggest that the AlGaN gate layer and oxidized Ni gate play a crucial role for high threshold voltage and low gate current.
Authors
- Yuji Ohmaki
- Takashi Mukai (ORCID: https://orcid.org/0000-0002-2290-8728)
- Shigeru Tada (ORCID: https://orcid.org/0000-0002-6378-7643)
- M. Tanimoto
- Jun Akamatsu
- Masahiko Sano
Institutions
- Nichia Corporation (Japan) (JP)
Publication Details
- Journal
- Japanese Journal of Applied Physics
- Published
- 2025-05-01
- DOI
- https://doi.org/10.35848/1347-4065/add5ad
- Primary Topic
- GaN-based semiconductor devices and materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00