Finite Element Analysis for Transient on Highly Thermal Hybridization Conductive Ink

Conductive ink, which can be produced using materials like graphene, possesses exceptional electrical conductivity and is cost-effective as well as environmentally friendly, making it ideal for future printed electronics. The conductive ink's properties also offer significant mechanical strength, excellent heat and electrical conductivity, thermal conductivity, thinness, and flexibility. The hybrid conductive ink, when combined with silver, often demonstrates superior conductivity and stability. This research aims to develop a highly thermal graphene hybrid conductive ink, using graphene nanoparticles, silver flakes, and silver acetate as conductive fillers mixed with chemical and organic solvents. However, reliable data on the finite element analysis (FEA) performance of these mixtures is still lacking. Therefore, to address this, the current study employs an FEA model to simulate total heat flux across various conductive ink perimeters, focusing on substrate size. The models were created using CAD software and analysed in ANSYS Mechanical software to simulate temperature and heat flux. The behaviour of five models with different substrate perimeters was examined using eight thermal conductivity. Additionally, temperature flow and heat flux flow transformation were measured in each model to assess the performance of the hybrid conductive ink. The results show that a 4x4 mm substrate size, with die-attach and diode sizes of 2x2 mm, provides the best performance at the highest thermal conductivity value (350 W/m.K), achieving a total heat flux of up to 6.6 MW/m². Overall, this research illustrates the importance of optimizing substrate size to improve thermal management in hybrid conductive inks.