Special Issue on COOL Chips

This introduction to the special section on COOL Chips discusses the state-of-the-art low-power, high-speed chips and the challenges facing researchers. It introduces three articles that explore different solutions to reducing power consumption and enhancing chip performance.

Authors

Ryusuke Egawa (ORCID: https://orcid.org/0000-0001-8966-867X)
Yasutaka Wada (ORCID: https://orcid.org/0000-0002-5489-0964)

Institutions

Tokyo Denki University (JP)
Meisei University (JP)

Publication Details

Journal: IEEE Micro
Published: 2025-03-01
DOI: https://doi.org/10.1109/mm.2025.3555464
Primary Topic: Polymer composites and self-healing
Type: article
Field-Weighted Citation Impact: 0.00

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article

Special Issue on COOL Chips

Ryusuke Egawa, Yasutaka Wada

Mar 1, 2025

IEEE Micro

Polymer composites and self-healing

article

Special Issue on COOL Chips

Ryusuke Egawa, Yasutaka Wada

March 1, 2025article en

Abstract

IEEE MicroVol. 45(2)

Tokyo Denki University (JP), Meisei University (JP)

Openalex Percentile: Top 92%

Polymer composites and self-healing

DOI Source OpenAlex

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Special Issue on COOL Chips — Ryusuke Egawa, Yasutaka Wada · IEEE Micro (2025) | TGRS Research Map | TGRS