Electroless Plating of Copper on Laser‐Induced Graphene for Flexible Hybrid Electronic Applications (Adv. Mater. Technol. 9/2025)
Flexible Hybrid Electronics In article number 2401901, David Estrada and co-workers demonstrate a new approach to flexible PCB manufacturing. Through the use of Pd nanoparticle catalysts embedded in laser-induced graphene, the electroless plating of copper traces enables a simple and innovative approach to advance flexible hybrid electronics research and manufacturing processes. Image credit: Alex Jerez, Scientific Illustrator.
Authors
- Josh Eixenberger (ORCID: https://orcid.org/0000-0002-9816-7268)
- Nicholas McKibben (ORCID: https://orcid.org/0000-0002-1546-5682)
- Tony Valayil Varghese (ORCID: https://orcid.org/0000-0002-3251-8395)
- Brian S. Cummings (ORCID: https://orcid.org/0000-0001-5388-9390)
- M. David Curtis (ORCID: https://orcid.org/0000-0002-1814-0867)
- John Timler
- David Estrada (ORCID: https://orcid.org/0000-0001-5894-0773)
- Attila Rektor
Institutions
- Micron (United States) (US)
- Boise State University (US)
- Idaho National Laboratory (US)
- Center for Advanced Energy Studies (US)
- Science Applications International Corporation (United States) (US)
Publication Details
- Journal
- Advanced Materials Technologies
- Published
- 2025-05-01
- DOI
- https://doi.org/10.1002/admt.202570046
- Primary Topic
- Electrodeposition and Electroless Coatings
- Type
- article
- Field-Weighted Citation Impact
- 0.00