A Method for Generating and Validating Kiss‐Bond Defects Using Adhesive Films and Sand

ABSTRACT Adhesive bonding provides uniform load distribution and reduces weight and costs. However, verifying the performance of adhesive structures is challenging due to inherent defects and manufacturing uncertainties, particularly kiss‐bond defects, which are hard to detect and have insufficient strength. This paper attempts to fabricate kiss‐bond defects using release agents or sand as contaminants. Verification results show that applying two layers of release agent achieves a fracture toughness of 33.86% of the nominal value, which is still relatively high. Sand particles, with a diameter of 53 μm proved to be a threshold and were effective in creating undetectable defects with near‐zero bonding strength. Destructive testing confirmed that the improved process ensures a single‐layer coverage of contaminants, preventing local accumulation.