Nanometer-precise DSA with DNA

DNA nanostructures offer immense potential as templates for nanoscale device fabrication, providing resolution and scalability beyond conventional top-down patterning methods. DNA nanostructures can self-align with nanoscale precision onto semiconductor surfaces using electrostatic interactions with hydrophilic sites patterned via electron-beam lithography (E-beam). This integration enables functionalization of device surfaces for applications such as biosensing. However, conventional DNA nanostructures are typically sub-100 nm and require E-beam patterning, which limits industrial scalability. Here, we present an approach that combines two scalable techniques: (i) bottom-up fractal assembly of DNA origami achieving feature sizes of 200–700 nm and (ii) top-down photolithographic patterning of binding sites on silicon substrates. This approach enables industrial-scale fabrication of bioelectronic sensors with nanometer precision.