Study of Cl2/Ar transient plasmas using a dynamic global model

Cl2/Ar plasmas are widely used in plasma processes. Recently, innovative plasma recipes have been developed that utilize transient plasmas to reduce gas consumption and optimize processes. The present study examines the kinetics play in transient plasmas, with a particular focus on the kinetics of residual species following a feed gas switch (Cl2→Ar) for various working parameters. It was observed that high pressure (>3 Pa) and low gas flow rate (<50 SCCM) contribute to long residual species lifetime (>100 ms), while the RF source power does not significantly affect residual species lifetime. The investigation focused on the minimum feed gas switch duration to align the plasma composition with the machine parameters. The results demonstrate that at high pressure, fast feed gas commutation cannot bypass the plasma kinetics, and longer feed gas switch duration may be required. Finally, abrupt RF source power variations induce drastic deviations of electron temperature and density at a small time scale (<10−4s). Such a result originates from the change of electron collision rate.

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Publication Details

Journal
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
Published
2025-05-01
DOI
https://doi.org/10.1116/6.0004464
Citations
1
Primary Topic
Plasma Diagnostics and Applications
Type
article
Field-Weighted Citation Impact
0.73

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article

Study of Cl2/Ar transient plasmas using a dynamic global model

Fabrice Roqueta, Mohamed Boufnichel, A. Rhallabi, C. Mannequin et al.
1 citations
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
Plasma Diagnostics and Applications
0.73
article

Study of Cl2/Ar transient plasmas using a dynamic global model

Fabrice Roqueta, Mohamed Boufnichel, A. Rhallabi, C. Mannequin, T. Rasoanarivo
article en
1 citations

Abstract

Cl2/Ar plasmas are widely used in plasma processes. Recently, innovative plasma recipes have been developed that utilize transient plasmas to reduce gas consumption and optimize processes. The present study examines the kinetics play in transient plasmas, with a particular focus on the kinetics of residual species following a feed gas switch (Cl2→Ar) for various working parameters. It was observed that high pressure (>3 Pa) and low gas flow rate (<50 SCCM) contribute to long residual species lifetime (>100 ms), while the RF source power does not significantly affect residual species lifetime. The investigation focused on the minimum feed gas switch duration to align the plasma composition with the machine parameters. The results demonstrate that at high pressure, fast feed gas commutation cannot bypass the plasma kinetics, and longer feed gas switch duration may be required. Finally, abrupt RF source power variations induce drastic deviations of electron temperature and density at a small time scale (<10−4s). Such a result originates from the change of electron collision rate.

Journal of Vacuum Science & Technology A Vacuum Surfaces and FilmsVol. 43(3)
Thales (Portugal) (PT), Centre National de la Recherche Scientifique (FR), Institut des Matériaux Jean Rouxel (FR), STMicroelectronics (Czechia) (CZ), Nantes Université (FR)
STMicroelectronics
Openalex Percentile: Top 29%
Plasma Diagnostics and Applications
0.73
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Study of Cl2/Ar transient plasmas using a dynamic global model — Fabrice Roqueta, Mohamed Boufnichel, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (2025) | TGRS Research Map | TGRS