Enhanced strength and conductivity of CuCrZr/CuAlCrFeNi2.5 multi-principal element alloy composite via interface and configuration engineering

Constructing multi-modal interface and configuration design is a highly promising strategy for the development of next-generation electrical contact composites. The CuAlCrFeNi 2.5 dual-phase multi-principal element alloy (MPEA) is designed as a reinforcement phase for copper-based composites, dual-phase enhanced configuration of multi-modal interfaces ensures a good combination of strength and conductivity, fabricated via a ball milling (BM)-spark plasma sintering (SPS) process. Further optimization of the interface and microstructural configuration, controlled by sintering temperature, achieving an outstanding combination of yield strength of 852 ± 20 MPa and electrical conductivity of 39.76 ± 0.13 International Annealed Copper Standard (IACS) at a sintering temperature of 723 K. A comprehensive analysis of the strengthening and conductivity mechanisms reveals the role of multi-modal interfaces and complex-scale configurations in achieving this balance. This work provides novel insights into the development of advanced ultra-high strength conductive materials.