A Novel Non-intrusive Online Monitoring Method for Diagnosing the Lift-off of Bonding wires in SiC MOSFETs
This article presents a real-time method for detecting bond wire lift-off in SiC MOSFETs using a transmission line impedance matching approach. By temporarily introducing a discrete transmission line (DTL) into the gate driving signal and observing energy changes on specific DTL sections, source inductance changes due to bond wire issues can be indirectly monitored. The technique was tested on a 40W, 48V/24V, 100kHz buck converter without requiring any external injection signal.
Authors
- Ho-Tin Tang (ORCID: https://orcid.org/0000-0002-4569-9519)
- Keqi Song (ORCID: https://orcid.org/0000-0002-5363-6067)
- Henry Shu-Hung Chung (ORCID: https://orcid.org/0000-0003-4890-8256)
Institutions
- City University of Hong Kong (HK)
Publication Details
- Published
- 2025-03-16
- DOI
- https://doi.org/10.1109/apec48143.2025.10977483
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Innovation and Technology Fund