Novel Approach of Determining and Predicting SiC MOSFET’s On Resistance From Device Case Temperature Using Machine Learning

Silicon-carbide (SiC) MOSFET devices are increasing in popularity in high-power converter applications. Device on-resistance (R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf>) is an important indicator for SiC MOSFET health status. Increments in R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> over device lifetime indicate imminent device failure and result in decreased system efficiency. Direct and accurate measurement of SiC MOSFET device R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> in high-power applications is difficult. Another approach is to estimate/predict the device R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> from other, more easily measurable quantities, however, little work has been done on this approach in the literature. This leaves a significant technical gap in measuring/predicting device R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> and slows down the device health status monitoring and power converter reliability research. To address the technical gaps, this work proposes a novel approach to predicting device R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> from thermal cycle count and instantaneous temperature using machine learning regression models. The actual hardware data collected from accelerated lifetime tests of high-power SiC MOSFETs are used to train, test, and validate the proposed machine-learning regression models. The developed models, coupled with cycle counting algorithms, and device case thermal measurements, provide accurate live estimates of R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> and can be used to predict changes in R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> over expected mission profiles during power converter design.

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Published
2025-03-16
DOI
https://doi.org/10.1109/apec48143.2025.10977206
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.00

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article

Novel Approach of Determining and Predicting SiC MOSFET’s On Resistance From Device Case Temperature Using Machine Learning

P. Bradford, Conner Deppe, Hongjie Wang
Silicon Carbide Semiconductor Technologies
article

Novel Approach of Determining and Predicting SiC MOSFET’s On Resistance From Device Case Temperature Using Machine Learning

P. Bradford, Conner Deppe, Hongjie Wang
article en

Abstract

Silicon-carbide (SiC) MOSFET devices are increasing in popularity in high-power converter applications. Device on-resistance (R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf>) is an important indicator for SiC MOSFET health status. Increments in R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> over device lifetime indicate imminent device failure and result in decreased system efficiency. Direct and accurate measurement of SiC MOSFET device R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> in high-power applications is difficult. Another approach is to estimate/predict the device R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> from other, more easily measurable quantities, however, little work has been done on this approach in the literature. This leaves a significant technical gap in measuring/predicting device R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> and slows down the device health status monitoring and power converter reliability research. To address the technical gaps, this work proposes a novel approach to predicting device R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> from thermal cycle count and instantaneous temperature using machine learning regression models. The actual hardware data collected from accelerated lifetime tests of high-power SiC MOSFETs are used to train, test, and validate the proposed machine-learning regression models. The developed models, coupled with cycle counting algorithms, and device case thermal measurements, provide accurate live estimates of R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> and can be used to predict changes in R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dson</inf> over expected mission profiles during power converter design.

Utah State University (US)
National Science Foundation
Affordable and clean energy
Openalex Percentile: Top 93%
Silicon Carbide Semiconductor Technologies
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