Discrete Power Device Packaging with Integrated Direct Two-Phase Cooling

This paper presents a discrete device packaging with integrated direct cooling. Firstly, the fabricated three-section heat pipe meets the common 650 V, 1200 V and 1700 V devices in terms of electrical insulation, while exhibiting thermal performance comparable to commercial heat pipes. This validates the feasibility of the proposed discrete device packaging. Secondly, the proposed discrete device was fabricated, and experimental results show that it has excellent thermal performance, with a temperature difference of less than 1.5 °C between the evaporator and the condenser. Additionally, simulations reveal that, under identical conditions, the proposed design achieves a 34.5°C reduction in junction temperature compared to conventional discrete device cooling solutions. The design is expected to be widely used in high power density converters.