A 3D Structure of Single-Sided Cooling Power Module with Low Thermal Resistance and Low Inductance

This paper describes the three-dimensional structure of a single-sided cooling power module that uses a lead frame as a heat conduction path to cool power semiconductor dies on both sides. The proposed structure achieves low thermal resistance and low inductance, improving the efficiency of motor drive inverters. Simulation results show that the thermal resistance is reduced by 18% and the parasitic commutation loop inductance is reduced by 60% compared to the conventional module. The manufacturability of the proposed module is confirmed by fabricating prototypes, and double pulse tests (800 V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DC</inf>, turn-on current of 300 A, turn-off current of 400 A) validate its electrical performance.