Electrical Evaluation of a Modular High Voltage 3D Power Module using Direct Dielectric Liquid Cooling
In this paper, a novel 3D power module structure based on direct dielectric liquid cooling is proposed for high voltage applications. This structure allows modular assembly and puts an end to the ever-existing compromise between high electrical insulation and high thermal performance, which usually requires a trade-off in the thickness of the ceramic layer. This proposed power module assembly is illustrated and then evaluated through electromagnetic and transient electric field simulations, using Ansys Q3D Extractor and Comsol®Multiphysics respectively. Stray inductance measurements are carried out using a precision impedance analyzer. Finally, direct current (DC) breakdown voltage measurements are conducted on the dielectric liquid alone and on the structure, submerged in the liquid, in order to evaluate its voltage withstand capability.
Authors
- Rachelle Hanna (ORCID: https://orcid.org/0000-0002-3320-8612)
- Yvan Avenas (ORCID: https://orcid.org/0000-0002-6079-8582)
- Emmanuel Marcault (ORCID: https://orcid.org/0000-0003-1276-5628)
- A. Philippe
- Omar Sanjakdar
- Guillaume Piquet Boisson
Institutions
- Institut polytechnique de Grenoble (FR)
- Centre National de la Recherche Scientifique (FR)
- Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR)
- Laboratoire d’Innovation pour les Technologies des Énergies Nouvelles et les nanomatériaux (FR)
- Direction de la Recherche Technologique (FR)
- Université Grenoble Alpes (FR)
Publication Details
- Published
- 2025-03-16
- DOI
- https://doi.org/10.1109/apec48143.2025.10977295
- Primary Topic
- Engineering Applied Research
- Type
- article
- Field-Weighted Citation Impact
- 0.00