Physics-informed Neural Network Approach for Early Degradation Trajectory Prediction of Power Semiconductor Modules

DC power cycling tests in semiconductor modules induces repetitive thermal-mechanical stresses that accumulate as fatigue over time. This paper proposes a physics-informed neural network method to reduce the reliability testing time for power semiconductor modules. The main objective of this study is to reduce the testing time while maintain a satisfactory degradation trajectory prediction accuracy using physics-informed data-driven methods. The impact of testing noise and inconsistencies from device to device is attenuated. On-state saturation voltage temperature-dependence compensation and physics based loss term regularization technique are applied in Long Short-Term Memory (LSTM) architechture, which can enhance the accuracy of degradation curve prediction under early degradation. A total of 18 IGBT devices were tested in the power cycling experiments. The proposed degradation curve prediction model can achieve an average end-of-life (EOL) prediction accuracy of 90% using approximately 40% of the early degradation testing data, which can reduce the testing time by about 60%.

Authors

Institutions

Publication Details

Published
2025-03-16
DOI
https://doi.org/10.1109/apec48143.2025.10977327
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Physics-informed Neural Network Approach for Early Degradation Trajectory Prediction of Power Semiconductor Modules

F. Y. Hansen, Huai Wang, Yi Zhang, Dao Zhou et al.
Silicon Carbide Semiconductor Technologies
article

Physics-informed Neural Network Approach for Early Degradation Trajectory Prediction of Power Semiconductor Modules

F. Y. Hansen, Huai Wang, Yi Zhang, Dao Zhou, Lukas Y. Wick, Yichi Zhang, Jie Kong
article en

Abstract

DC power cycling tests in semiconductor modules induces repetitive thermal-mechanical stresses that accumulate as fatigue over time. This paper proposes a physics-informed neural network method to reduce the reliability testing time for power semiconductor modules. The main objective of this study is to reduce the testing time while maintain a satisfactory degradation trajectory prediction accuracy using physics-informed data-driven methods. The impact of testing noise and inconsistencies from device to device is attenuated. On-state saturation voltage temperature-dependence compensation and physics based loss term regularization technique are applied in Long Short-Term Memory (LSTM) architechture, which can enhance the accuracy of degradation curve prediction under early degradation. A total of 18 IGBT devices were tested in the power cycling experiments. The proposed degradation curve prediction model can achieve an average end-of-life (EOL) prediction accuracy of 90% using approximately 40% of the early degradation testing data, which can reduce the testing time by about 60%.

Aalborg University (DK)
Climate action
Openalex Percentile: Top 93%
Silicon Carbide Semiconductor Technologies
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.