Optimizing Thin Electric Functional Copper Coatings via Atmospheric Plasma Spray: Impact of Particle Temperature and Velocity

Abstract The objective of this study is to optimize thin electric and mechanical functional copper coatings using atmospheric plasma spray by determining the impact of particle temperature and velocity on coating properties. A particular focus is placed on the formation of real contact between the particles within the coating, which is crucial for electrical conductivity while the contact at the interface is essential for adhesive strength.

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Publication Details

Journal
Thermal spray
Published
2025-05-01
DOI
https://doi.org/10.31399/asm.cp.itsc2025p0192
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
0.00

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article

Optimizing Thin Electric Functional Copper Coatings via Atmospheric Plasma Spray: Impact of Particle Temperature and Velocity

Matthias Petersen, Manuela Ockel, Jörg Franke, Nils Thielen et al.
1 links
Thermal spray
Copper Interconnects and Reliability
article

Optimizing Thin Electric Functional Copper Coatings via Atmospheric Plasma Spray: Impact of Particle Temperature and Velocity

Matthias Petersen, Manuela Ockel, Jörg Franke, Nils Thielen, Aleyna Gökçen, Florian Risch
article en

Abstract

Abstract The objective of this study is to optimize thin electric and mechanical functional copper coatings using atmospheric plasma spray by determining the impact of particle temperature and velocity on coating properties. A particular focus is placed on the formation of real contact between the particles within the coating, which is crucial for electrical conductivity while the contact at the interface is essential for adhesive strength.

Thermal sprayVol. 85045
Friedrich-Alexander-Universität Erlangen-Nürnberg (DE)
Deutsche Forschungsgemeinschaft
Openalex Percentile: Top 95%
Copper Interconnects and Reliability
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