Consideration of Causes and Countermeasures for Difference in Acid Copper Plating Thickness Between Different Diameter Vias

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Publication Details

Journal
Journal of The Surface Finishing Society of Japan
Published
2024-11-01
DOI
https://doi.org/10.4139/sfj.75.517
Primary Topic
Copper Interconnects and Reliability
Type
article
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article

Consideration of Causes and Countermeasures for Difference in Acid Copper Plating Thickness Between Different Diameter Vias

Masayuki Kiso, Daisuke Hashimoto, Akira Tanimoto
Journal of The Surface Finishing Society of Japan
Copper Interconnects and Reliability
article

Consideration of Causes and Countermeasures for Difference in Acid Copper Plating Thickness Between Different Diameter Vias

Masayuki Kiso, Daisuke Hashimoto, Akira Tanimoto
article en

Abstract

No abstract available for this paper.
Journal of The Surface Finishing Society of JapanVol. 75(11)
Nomura Research Institute (JP)
Openalex Percentile: Top 84%
Copper Interconnects and Reliability
DOIOpen Access PDFOpenAlex
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Consideration of Causes and Countermeasures for Difference in Acid Copper Plating Thickness Between Different Diameter Vias — Masayuki Kiso, Daisuke Hashimoto, et al. · Journal of The Surface Finishing Society of Japan (2024) | TGRS Research Map | TGRS