Authors

• George Okada
• Hiroyoshi Yoshida
• Rieko Okumura
• Kei Hashizume
• Masahiko Nishijima (ORCID: https://orcid.org/0000-0002-5143-7558)
• Katsuaki Suganuma (ORCID: https://orcid.org/0000-0003-2137-9905)
• Hiroshi Nishikawa (ORCID: https://orcid.org/0000-0002-4363-9520)
• Zheng Zhang (ORCID: https://orcid.org/0000-0003-2520-3026)
• Kimihiro Yamanaka
• Ming-Chun Hsieh
• Hiroki Seto

Institutions

• Shanghai Shipbuilding Technology Research Institute (CN)
• The University of Osaka (JP)

Publication Details

Journal

Journal of The Surface Finishing Society of Japan

Published

2024-11-01

DOI

https://doi.org/10.4139/sfj.75.513

Citations

1

Primary Topic

3D IC and TSV technologies

Type

article

Field-Weighted Citation Impact

0.21