Investigation of the Adhesion Mechanism of Electro-Less Copper Plating on Surface Reformed Resin by Using a 172 nm Xe<sub>2</sub><sup>*</sup> Excimer Lamp

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Publication Details

Journal
Journal of The Surface Finishing Society of Japan
Published
2024-11-01
DOI
https://doi.org/10.4139/sfj.75.494
Primary Topic
Copper Interconnects and Reliability
Type
article
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article

Investigation of the Adhesion Mechanism of Electro-Less Copper Plating on Surface Reformed Resin by Using a 172 nm Xe2* Excimer Lamp

Taro Arimoto
Journal of The Surface Finishing Society of Japan
Copper Interconnects and Reliability
article

Investigation of the Adhesion Mechanism of Electro-Less Copper Plating on Surface Reformed Resin by Using a 172 nm Xe2* Excimer Lamp

Taro Arimoto
article en

Abstract

No abstract available for this paper.
Journal of The Surface Finishing Society of JapanVol. 75(11)
Ushio (Japan) (JP), The University of Osaka (JP)
Openalex Percentile: Top 84%
Copper Interconnects and Reliability
DOIOpen Access PDFOpenAlex
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Investigation of the Adhesion Mechanism of Electro-Less Copper Plating on Surface Reformed Resin by Using a 172 nm Xe<sub>2</sub><sup>*</sup> Excimer Lamp — Taro Arimoto · Journal of The Surface Finishing Society of Japan (2024) | TGRS Research Map | TGRS