High-Adhesion Copper Plating on Glass Using Metal Oxides Deposited by Liquid Phase Deposition Method

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Publication Details

Journal
Journal of The Surface Finishing Society of Japan
Published
2024-11-01
DOI
https://doi.org/10.4139/sfj.75.483
Primary Topic
Copper Interconnects and Reliability
Type
article
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article

High-Adhesion Copper Plating on Glass Using Metal Oxides Deposited by Liquid Phase Deposition Method

Masahito Hayamizu, Mayu TSUKUDA
Journal of The Surface Finishing Society of Japan
Copper Interconnects and Reliability
article

High-Adhesion Copper Plating on Glass Using Metal Oxides Deposited by Liquid Phase Deposition Method

Masahito Hayamizu, Mayu TSUKUDA
article en

Abstract

No abstract available for this paper.
Journal of The Surface Finishing Society of JapanVol. 75(11)
Panasonic (Japan) (JP), Panasonic (United States) (US)
Openalex Percentile: Top 84%
Copper Interconnects and Reliability
DOIOpen Access PDFOpenAlex
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High-Adhesion Copper Plating on Glass Using Metal Oxides Deposited by Liquid Phase Deposition Method — Masahito Hayamizu, Mayu TSUKUDA · Journal of The Surface Finishing Society of Japan (2024) | TGRS Research Map | TGRS