Electroless Plating of Barrier Metal for TSV of 3-D Integration and Cu direct ECP Filling on It

Authors

Shoso Shingubara (ORCID: https://orcid.org/0000-0003-2134-1691)

Institutions

Kansai University (JP)

Publication Details

Journal: Journal of The Surface Finishing Society of Japan
Published: 2024-11-01
DOI: https://doi.org/10.4139/sfj.75.478
Primary Topic: 3D IC and TSV technologies
Type: article
Field-Weighted Citation Impact: 0.00

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article

Electroless Plating of Barrier Metal for TSV of 3-D Integration and Cu direct ECP Filling on It

Shoso Shingubara

Nov 1, 2024

4 links

Journal of The Surface Finishing Society of Japan

3D IC and TSV technologies

article

Electroless Plating of Barrier Metal for TSV of 3-D Integration and Cu direct ECP Filling on It

Shoso Shingubara

November 1, 2024article en

Abstract

No abstract available for this paper.

Journal of The Surface Finishing Society of JapanVol. 75(11)

Kansai University (JP)

Openalex Percentile: Top 72%

3D IC and TSV technologies

DOI Open Access PDF OpenAlex

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Electroless Plating of Barrier Metal for TSV of 3-D Integration and Cu direct ECP Filling on It — Shoso Shingubara · Journal of The Surface Finishing Society of Japan (2024) | TGRS Research Map | TGRS