A Highly Sensitive Piezoresistive Electronic Skin: Coulomb Blockade-Favored Dynamic Conduction Paths in Micellar Brush-Templated Metal Nanoarrays

The creation of tailored micro-nanostructures frequently brings intriguing features to flexible electronic skins (E-skins). However, the construction of nanoscale architectures on soft substrates under mild conditions remains a critical challenge. Herein, we report a facile micellar brush-templated strategy for the precise fabrication of conductive metal nanoarrays on diverse flexible substrates. Erect micelle/Pt-nanoarrays with precisely tunable heights are prepared through surface-initiated living growth of cylindrical micellar brushes followed by the dense decoration of Pt nanoparticles at an ambient temperature. The stacking of nanoparticles imparts distinctive electron transport characteristics, facilitating the establishment of dynamic conductive pathways during interlocking and resulting in substantial enhancement of pressure sensitivity. Thus, the micelle/Pt-nanoarray-based E-skin reveals remarkably high sensitivity over a wide pressure range, enabling comprehensive detection capabilities encompassing foot pressure, finger bending, wrist pulse, and weak gas flow. Moreover, these conductive metal nanoarrays can be readily fabricated on soft substrates with a tortuous surface, favoring the formation of hierarchically structured E-skin with linear response across a broad scale.

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Publication Details

Journal
Chemistry of Materials
Published
2025-04-30
DOI
https://doi.org/10.1021/acs.chemmater.5c00031
Citations
2
Primary Topic
Advanced Sensor and Energy Harvesting Materials
Type
article
Field-Weighted Citation Impact
1.35

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article

A Highly Sensitive Piezoresistive Electronic Skin: Coulomb Blockade-Favored Dynamic Conduction Paths in Micellar Brush-Templated Metal Nanoarrays

Jiawei Tao, Huibin Qiu, Hongti Zhang, Yurui Xing et al.
2 citations
Chemistry of Materials
Advanced Sensor and Energy Harvesting Materials
1.35
article

A Highly Sensitive Piezoresistive Electronic Skin: Coulomb Blockade-Favored Dynamic Conduction Paths in Micellar Brush-Templated Metal Nanoarrays

Jiawei Tao, Huibin Qiu, Hongti Zhang, Yurui Xing, Geyu Lin, Shuang Wang, Yao Lu
article en
2 citations

Abstract

The creation of tailored micro-nanostructures frequently brings intriguing features to flexible electronic skins (E-skins). However, the construction of nanoscale architectures on soft substrates under mild conditions remains a critical challenge. Herein, we report a facile micellar brush-templated strategy for the precise fabrication of conductive metal nanoarrays on diverse flexible substrates. Erect micelle/Pt-nanoarrays with precisely tunable heights are prepared through surface-initiated living growth of cylindrical micellar brushes followed by the dense decoration of Pt nanoparticles at an ambient temperature. The stacking of nanoparticles imparts distinctive electron transport characteristics, facilitating the establishment of dynamic conductive pathways during interlocking and resulting in substantial enhancement of pressure sensitivity. Thus, the micelle/Pt-nanoarray-based E-skin reveals remarkably high sensitivity over a wide pressure range, enabling comprehensive detection capabilities encompassing foot pressure, finger bending, wrist pulse, and weak gas flow. Moreover, these conductive metal nanoarrays can be readily fabricated on soft substrates with a tortuous surface, favoring the formation of hierarchically structured E-skin with linear response across a broad scale.

Chemistry of MaterialsVol. 37(9)
Shanghai Jiao Tong University (CN), ShanghaiTech University (CN), Bio-Synthesis (United States) (US), Center for High Pressure Science & Technology Advanced Research (CN)
National Natural Science Foundation of China, Shanghai Municipal Education Commission, Science and Technology Commission of Shanghai Municipality, National Key Research and Development Program of China, Fundamental Research Funds for the Central Universities
Openalex Percentile: Top 20%
Advanced Sensor and Energy Harvesting Materials
1.35
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