Cost‐Effective Symmetric PbSe‐Based Device for Thermoelectric Cooling

Thermoelectric cooling technology has broad applications but is limited by the high cost of tellurium (Te) in commercially available Bi<sub>2</sub>Te<sub>3</sub>-based thermoelectric materials. Herein, a cost-effective symmetric PbSe-based device constructed from 7 pairs of Pb<sub>0.988</sub>Cu<sub>0.002</sub>Se (p-type) and Pb<sub>1.02</sub>Cu<sub>0.002</sub>Se (n-type) is presented, which demonstrates impressive cooling temperature difference (ΔT<sub>C</sub>) of 32.8 and 41.0 K with the hot side maintained at 303 and 343 K, respectively. This low-cost symmetric PbSe-based device exhibits superior cost-effectiveness (ΔT/cost) for near-room-temperature thermoelectric cooling compared to other Bi<sub>2</sub>Te<sub>3</sub>-based devices. Its high cooling performance primarily stems from an advanced carrier and phonon transport properties in p-type Pb<sub>0.988</sub>Cu<sub>0.002</sub>Se. Specifically, Pb vacancy and Cu substitution in Pb<sub>0.988</sub>Cu<sub>0.002</sub>Se act as strong p-type dopants that effectively optimize carrier density, resulting in a maximum power factor of 28.69 µW cm<sup>-1</sup> K<sup>-2</sup> at room temperature. Moreover, the mobile Cu atoms within the lattice significantly impede phonon propagation, leading to a low room-temperature lattice thermal conductivity of 1.10 W m<sup>-1</sup> K<sup>-1</sup>. Finally, the room-temperature figure of merit (ZT) and average ZT value in p-type Pb<sub>0.988</sub>Cu<sub>0.002</sub>Se can reach 0.6 and 0.68 at 300-573 K, surpassing previous p-type PbSe-based polycrystals. This work emphasizes the significant potential of a cost-effective PbSe compound for near-room-temperature cooling applications.

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Publication Details

Journal
Advanced Materials
Published
2025-04-29
DOI
https://doi.org/10.1002/adma.202502705
Citations
9
Primary Topic
Advanced Thermoelectric Materials and Devices
Type
article
Field-Weighted Citation Impact
4.66

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article

Cost‐Effective Symmetric PbSe‐Based Device for Thermoelectric Cooling

Li‐Dong Zhao, Liqing Xu, Yu Xiao, Tao Hong et al.
9 citations
Advanced Materials
Advanced Thermoelectric Materials and Devices
4.66
article

Cost‐Effective Symmetric PbSe‐Based Device for Thermoelectric Cooling

Li‐Dong Zhao, Liqing Xu, Yu Xiao, Tao Hong, Tianhang Zhou, Sining Wang, Shibo Liu, Dongrui Liu
article en
9 citations

Abstract

Thermoelectric cooling technology has broad applications but is limited by the high cost of tellurium (Te) in commercially available Bi<sub>2</sub>Te<sub>3</sub>-based thermoelectric materials. Herein, a cost-effective symmetric PbSe-based device constructed from 7 pairs of Pb<sub>0.988</sub>Cu<sub>0.002</sub>Se (p-type) and Pb<sub>1.02</sub>Cu<sub>0.002</sub>Se (n-type) is presented, which demonstrates impressive cooling temperature difference (ΔT<sub>C</sub>) of 32.8 and 41.0 K with the hot side maintained at 303 and 343 K, respectively. This low-cost symmetric PbSe-based device exhibits superior cost-effectiveness (ΔT/cost) for near-room-temperature thermoelectric cooling compared to other Bi<sub>2</sub>Te<sub>3</sub>-based devices. Its high cooling performance primarily stems from an advanced carrier and phonon transport properties in p-type Pb<sub>0.988</sub>Cu<sub>0.002</sub>Se. Specifically, Pb vacancy and Cu substitution in Pb<sub>0.988</sub>Cu<sub>0.002</sub>Se act as strong p-type dopants that effectively optimize carrier density, resulting in a maximum power factor of 28.69 µW cm<sup>-1</sup> K<sup>-2</sup> at room temperature. Moreover, the mobile Cu atoms within the lattice significantly impede phonon propagation, leading to a low room-temperature lattice thermal conductivity of 1.10 W m<sup>-1</sup> K<sup>-1</sup>. Finally, the room-temperature figure of merit (ZT) and average ZT value in p-type Pb<sub>0.988</sub>Cu<sub>0.002</sub>Se can reach 0.6 and 0.68 at 300-573 K, surpassing previous p-type PbSe-based polycrystals. This work emphasizes the significant potential of a cost-effective PbSe compound for near-room-temperature cooling applications.

Advanced MaterialsVol. 37(27)
University of Electronic Science and Technology of China (CN), China University of Petroleum, Beijing (CN), Beihang University (CN)
National Natural Science Foundation of China, Natural Science Foundation of Sichuan Province, National Key Research and Development Program of China
Affordable and clean energy
Openalex Percentile: Top 5%
Advanced Thermoelectric Materials and Devices
4.66
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