1200V 4H-SiC MOSFET with a High-K Source Gate for Improving Third-Quadrant and High Frequency Figure of Merit Performance

This paper proposes a 1200V 4H-SiC MOSFET incorporating a High-K dielectric-integrated fused source-gate (HKSG) structure, engineered to concurrently enhance the third-quadrant operation and high-frequency figure of merit (HF-FOM). The High-K dielectric enhances the electric field effect, reducing the threshold voltage of the source-gate. As a result, the reverse conduction voltage drops from 2.79 V (body diode) to 1.53 V, and the bipolar degradation is eliminated. Moreover, by incorporating a shielding area within the merged source-gate architecture, the gate-to-drain capacitance <i>C</i><sub>gd</sub> of the HKSG-MOS is reduced. The simulation results show that the HF-FOM <i>C</i><sub>gd</sub> × <i>R</i><sub>on,sp</sub> and <i>Q</i><sub>gd</sub> × <i>R</i><sub>on,sp</sub> of the HKSG-MOS are decreased by 48.1% and 58.9%, respectively, compared with that of conventional SiC MOSFET. The improved performances make the proposed SiC MOSFEET have great potential in high-frequency power applications.

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Publication Details

Journal
Micromachines
Published
2025-04-27
DOI
https://doi.org/10.3390/mi16050508
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
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article

1200V 4H-SiC MOSFET with a High-K Source Gate for Improving Third-Quadrant and High Frequency Figure of Merit Performance

Tianci Li, Yi Kang, Xiarong Hu, Shan Lu et al.
Micromachines
Silicon Carbide Semiconductor Technologies
article

1200V 4H-SiC MOSFET with a High-K Source Gate for Improving Third-Quadrant and High Frequency Figure of Merit Performance

Tianci Li, Yi Kang, Xiarong Hu, Shan Lu, Mingyue Li, Zhaofeng Qiu
article en

Abstract

This paper proposes a 1200V 4H-SiC MOSFET incorporating a High-K dielectric-integrated fused source-gate (HKSG) structure, engineered to concurrently enhance the third-quadrant operation and high-frequency figure of merit (HF-FOM). The High-K dielectric enhances the electric field effect, reducing the threshold voltage of the source-gate. As a result, the reverse conduction voltage drops from 2.79 V (body diode) to 1.53 V, and the bipolar degradation is eliminated. Moreover, by incorporating a shielding area within the merged source-gate architecture, the gate-to-drain capacitance <i>C</i><sub>gd</sub> of the HKSG-MOS is reduced. The simulation results show that the HF-FOM <i>C</i><sub>gd</sub> × <i>R</i><sub>on,sp</sub> and <i>Q</i><sub>gd</sub> × <i>R</i><sub>on,sp</sub> of the HKSG-MOS are decreased by 48.1% and 58.9%, respectively, compared with that of conventional SiC MOSFET. The improved performances make the proposed SiC MOSFEET have great potential in high-frequency power applications.

MicromachinesVol. 16(5)
Xihua University (CN), Southwest Jiaotong University (CN)
Affordable and clean energy
Openalex Percentile: Top 93%
Silicon Carbide Semiconductor Technologies
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