Vertical Transition of Transmission Lines Based on Tiered Circuit Boards Process

In this work, two low-loss vertical transitions are presented for tiered circuit board transmission line. The first configuration achieves strong coupling between two opposite tiered circuit board transmission lines by etching a rectangular slot in the ground plane. Simulation results demonstrate that the vertical transition has a reflection coefficient better than 25 dB from 28 GHz to 32 GHz, and an insertion loss of about 0.2 dB. The second configuration connects the upper and lower TCB TLs directly by means of slopes and mortise-tenon structure. Simulation results exhibit that the vertical transition has a reflection coefficient better than 28 dB and an insertion loss of about 0.2 dB from 10 to 32 GHz. This configuration is characterized by ultra-broadband.