Exploiting the Memory-Compute-Coupling Feature for CIM Accelerator Design Optimization
SRAM computing-in-memory (CIM) accelerators have evolved as a promising solution to the memory wall problem in neural network (NN) models. By integrating memory and compute resources in each macro, CIM accelerators offer massive in-situ computing parallelism and large memory capacity, enabling spatial mapping with layer fusion and potentially keeping layers stationary in CIM. However, CIM’s memory-compute coupling (MCC) feature poses challenges in designing CIM accelerators. From an architecture aspect, designers must balance CIM’s memory and compute resources by optimizing the macro’s memory-compute ratio (MCR) configuration across diverse scenarios. From a mapping aspect, conventional mappings, which allocate each macro exclusively to each layer, face two major problems: a layer-fusion dilemma (the accelerator suffers from excessive memory access due to layer replications or performance degradation due to load imbalance) and a layer-eviction issue (storing layers stationary in CIM is usually infeasible due to limited CIM capacity). To address these challenges, this paper introduces MCC-DSE, an MCC-aware Design Space Exploration framework for architecture-mapping co-optimization of CIM accelerators. We also propose a three-axis CIM division mapping, which interleaves multiple layers in each macro to concurrently optimize memory access and performance during layer fusion as well as reserves a part of CIM memory in each macro for layer pinning. Compared to baseline architecture and mapping, MCC-DSE shows a 1.4x 8.3x EDP reduction across various workloads and chip areas. Moreover, MCC-DSE provides insights into CIM accelerator optimization, such as selecting optimal MCR and configuring CIM dynamically for different scenarios.
Authors
- Jia Chen (ORCID: https://orcid.org/0000-0002-9896-1656)
- Liang Chang (ORCID: https://orcid.org/0000-0002-6685-5576)
- Fengbin Tu (ORCID: https://orcid.org/0000-0003-2228-8829)
- Pingcheng Dong (ORCID: https://orcid.org/0000-0003-3975-286X)
- Yonghao Tan (ORCID: https://orcid.org/0000-0001-5372-5863)
- Jingyu He (ORCID: https://orcid.org/0000-0001-5908-8738)
- Chi-Ying Tsui (ORCID: https://orcid.org/0000-0002-8024-2637)
- Kwang‐Ting Cheng (ORCID: https://orcid.org/0000-0002-3885-4912)
- Xiaomeng Wang (ORCID: https://orcid.org/0000-0003-2169-3013)
- Yu Wang (ORCID: https://orcid.org/0000-0001-6108-5157)
- Xin Zhao (ORCID: https://orcid.org/0000-0003-4623-9829)
- Zhenhua Zhu (ORCID: https://orcid.org/0009-0007-9259-7180)
- Yongkun Wu (ORCID: https://orcid.org/0009-0009-9002-7453)
Institutions
- University of Electronic Science and Technology of China (CN)
- Hong Kong University of Science and Technology (HK)
- University of Hong Kong (HK)
- Tsinghua University (CN)
Publication Details
- Journal
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
- Published
- 2025-04-29
- DOI
- https://doi.org/10.1109/tcad.2025.3565487
- Primary Topic
- Distributed and Parallel Computing Systems
- Type
- article
- Field-Weighted Citation Impact
- 0.00