Recent Sinter-Bonding Technology of Power Semiconductor Using Silver Particles

The rapid development of industries such as electric vehicles, aerospace, and renewable energy has intensified the demand for high-performance power semiconductors. Silver (Ag) sintering has emerged as a lead-free alternative for power semiconductor packaging due to its high thermal and electrical conductivity, superior reliability, and high melting temperature. This paper introduces Ag-based sintering technology, classifying it into pressure-assisted and pressureless methods. Additionally, the use of Ag-Cu composite particles is discussed as a cost-effective approach, utilizing high performance of Ag and lower material cost of Cu to reduce overall expenses. We provide an overview of key processing conditions, material compositions, and recent advancements in Ag sintering technology.