Optimization mechanism of laminated ceramic package structure on the regulation of semiconductor cooling performance

The refrigeration performance of semiconductor refrigeration devices is limited by, among other things, the thermal conductivity of the materials. Optimisation of ceramic materials for semiconductor packaging offers the possibility of improving system performance. In this paper, a mathematical model of the semiconductor refrigeration process is established using the cooling capacity and the cooling coefficient as evaluation indexes. It investigates the effects of current, cold end temperature and hot end temperature on the cooling performance. A simulation model of laminated encapsulated materials is proposed to investigate the influence of the structure of encapsulated ceramic materials on the condensation effect. The results show that a small increase in current significantly increases the cooling capacity at low cold-end temperatures, while this effect diminishes at higher cold-end temperatures. An increase in the hot end temperature decreases the cooling capacity and coefficient, with the decrease being more pronounced at higher currents. In addition, as the thermal conductivity of the encapsulated ceramic material decreases along the direction perpendicular to the ceramic structure, heat transfer is directed more effectively, resulting in improved cooling efficiency and condensation. These findings provide new insights into the design of ceramic materials and optimisation of the efficiency of semiconductor cooling systems.