Synthesis of <scp>IPDI</scp>@<scp>PU</scp> Microcapsule Curing Agent and Its Curing Behavior for Epoxy Resin

ABSTRACT The development of latent curing agents is essential for advancements in industrial applications. In this study, we synthesize the IPDI@PU microcapsule curing agent with a regular spherical morphology and a uniform size distribution through interfacial polymerization using a lignin‐stabilized O/W Pickering emulsion as a template. The encapsulation of IPDI within the PU shell effectively inhibits its curing activity. Furthermore, the presence of the PU shell does not change the rapid reaction kinetics of the curing system. Importantly, after a storage period of 30 days at 40°C, the curing degree of the IPDI@PU/EP system is measured at only 6.4%, indicating excellent storage stability and great potential for practical applications.

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Publication Details

Journal
Journal of Applied Polymer Science
Published
2025-04-25
DOI
https://doi.org/10.1002/app.57216
Citations
1
Primary Topic
Epoxy Resin Curing Processes
Type
article
Field-Weighted Citation Impact
0.71

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article

Synthesis of IPDI@PU Microcapsule Curing Agent and Its Curing Behavior for Epoxy Resin

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Journal of Applied Polymer Science
Epoxy Resin Curing Processes
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article

Synthesis of IPDI@PU Microcapsule Curing Agent and Its Curing Behavior for Epoxy Resin

Ningyu Di, Weipeng Cao, Junkuo Gao, Xiaomin Li, Bin Ling, Mingyang Zhao
article en
1 citations

Abstract

ABSTRACT The development of latent curing agents is essential for advancements in industrial applications. In this study, we synthesize the IPDI@PU microcapsule curing agent with a regular spherical morphology and a uniform size distribution through interfacial polymerization using a lignin‐stabilized O/W Pickering emulsion as a template. The encapsulation of IPDI within the PU shell effectively inhibits its curing activity. Furthermore, the presence of the PU shell does not change the rapid reaction kinetics of the curing system. Importantly, after a storage period of 30 days at 40°C, the curing degree of the IPDI@PU/EP system is measured at only 6.4%, indicating excellent storage stability and great potential for practical applications.

Journal of Applied Polymer ScienceVol. 142(30)
Zhejiang Sci-Tech University (CN), Zhejiang Yongning Pharma (China) (CN)
National Natural Science Foundation of China, Zhejiang Sci-Tech University, Natural Science Foundation of Zhejiang Province
Openalex Percentile: Top 33%
Epoxy Resin Curing Processes
0.71
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