Research progress on consolidated diamond wire saw for brittle materials

Diamond wire saws can cut brittle materials with high precision, high efficiency, and minimal damage. They are widely used in silicon wafer slicing in integrated circuits and the photovoltaic industry. In this paper, the development history of the diamond wire saw is introduced, particularly the preparation of a diamond wire saw and the influence of the optimization of the preparation process on performance. Finally, the future development trends and challenges of diamond wire sawing are discussed. Research results show that diamond wire saw wire strength compared to that of a traditional saw wire increased by 3 times, the slicing efficiency of the saw wire line increased by 2–3 times, and the loss of the saw slit can be reduced to 0.16mm. In addition, study found that by increasing the speed of the wire travelling during slicing and processing and reducing the feed speed, the material can be cut via plastic shear, and the surface quality of the material will be considerably improved. With the rapid development of integrated circuits, photovoltaics, and optical technology, the demand for brittle materials is increasing, and the development of diamond wire is promising. Therefore, research on diamond wires is of great practical significance for the further improvement of the preparation process, selection of process parameters, production of high-quality slices, and development of integrated circuits.