Life Prediction Model for Press-Pack IGBT Module Based on Thermal Resistance Degradation

The contact interfaces of a press-pack insulated-gate bipolar transistor (PP-IGBT) module under fluctuating thermal stress will undergo minor friction and mutual sliding during service, which results in damage to the contact surface and a decline in the thermal performance of the contact interface. Therefore, the temperature inside the module will continue to increase, leading to eventual failure. In this work, a life prediction method based on thermal resistance degradation within a PP-IGBT module is established. The junction temperature can be determined via power loss and a resistance-capacitance (RC) thermal network model, and a life prediction model of the PP-IGBT module is developed based on thermal resistance degradation. The method considers the service quality under power cycling conditions and the influence of the self-accelerating effect of damage accumulation at the contact interface of the PP-IGBT module on fatigue life. The experimental results verify that the proposed PP-IGBT module life prediction method can effectively predict service life under power cycling conditions.