A New Matrix Percolation Model for Dielectric Breakdown With Nonuniform Defect Generation

In this study, we propose a new matrix version of the existing dielectric breakdown (BD) percolation model for non-uniform defect generation. Its calculation framework is established utilizing the graph theory of discrete mathematical. This new model is verified by applying to the case of high-<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">k</i>/interfacial layer bilayer gate stack. Furthermore, we also demonstrate the potential of this model in its application to MOSFET’s off-state TDDB or other complex situations by incorporating the TCAD simulations. The flexibility and extensibility of the model is beneficial for further understanding the physical mechanisms of dielectric breakdown in general cases.

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Publication Details

Journal
IEEE Electron Device Letters
Published
2025-04-24
DOI
https://doi.org/10.1109/led.2025.3563934
Citations
2
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
0.85

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article

A New Matrix Percolation Model for Dielectric Breakdown With Nonuniform Defect Generation

Chu Yan, Yi Zhao
2 citations
IEEE Electron Device Letters
Copper Interconnects and Reliability
0.85
article

A New Matrix Percolation Model for Dielectric Breakdown With Nonuniform Defect Generation

Chu Yan, Yi Zhao
article en
2 citations

Abstract

In this study, we propose a new matrix version of the existing dielectric breakdown (BD) percolation model for non-uniform defect generation. Its calculation framework is established utilizing the graph theory of discrete mathematical. This new model is verified by applying to the case of high-<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">k</i>/interfacial layer bilayer gate stack. Furthermore, we also demonstrate the potential of this model in its application to MOSFET’s off-state TDDB or other complex situations by incorporating the TCAD simulations. The flexibility and extensibility of the model is beneficial for further understanding the physical mechanisms of dielectric breakdown in general cases.

IEEE Electron Device LettersVol. 46(7)
Zhejiang University (CN)
National Science and Technology Major Project
Affordable and clean energy
Openalex Percentile: Top 29%
Copper Interconnects and Reliability
0.85
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A New Matrix Percolation Model for Dielectric Breakdown With Nonuniform Defect Generation — Chu Yan, Yi Zhao · IEEE Electron Device Letters (2025) | TGRS Research Map | TGRS