Advanced packaging raw materials assurance by characterization

Heterogeneous integration (HI) is rapidly becoming the foundation for high-performance systems, driven by the need for smaller, more efficient, and highly integrated electronic systems. As chiplets incorporate diverse materials that are embedded in advanced packaging, material quality assurance becomes paramount to prevent device failures and ensure long-term reliability. In this study, we define key failure metrics for the materials in question and propose advanced microscopy techniques for evaluating these materials. Advanced microscopy techniques are utilized to assess essential material properties including refractive index, dielectric constant, crystal orientation, and thermal coefficients. This research work aims to create a comprehensive framework for identifying critical components within HI chips, with a focus on testing and validating the materials to ensure mitigating material vulnerabilities in the semiconductor supply chain. This study also addresses how substandard materials can adversely impact device performance, including increased signal attenuation, thermal management issues, and reduced dielectric reliability.