Interface state density reduction by ultraviolet–ozone treatment on Al<sub>2</sub>O<sub>3</sub>/GeO<sub>2</sub> films
Abstract GeO2 prepared via thermal oxidation at ambient pressure is known to be of poor-quality owing to numerous defects and high interface states. Several methods for fabricating high-quality GeO2 films been reported, such as applying pressure, but all of them present challenges. Therefore, a simpler fabrication method is required. In this study, we attempted to reduce defects and interface states in GeO2/Ge prepared via atmospheric-pressure thermal oxidation using ultraviolet–ozone (UVO) treatment. Measurement results indicated that UVO treatment can reduce defects and interface states to the same level as that of high-quality GeO2/Ge reported thus far.
Authors
- Yoshiharu Kirihara (ORCID: https://orcid.org/0000-0003-0652-5660)
- Ryousuke Ishikawa (ORCID: https://orcid.org/0000-0002-3857-6940)
- Hiroshi Nohira (ORCID: https://orcid.org/0000-0003-0225-0292)
- Tomoki Yoshida
- Sorato Mikawa
- Kota Miura
Institutions
- Tokyo City University (JP)
Publication Details
- Journal
- Japanese Journal of Applied Physics
- Published
- 2025-04-24
- DOI
- https://doi.org/10.35848/1347-4065/add01f
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00