A Mode-Localized Pressure Sensor With Dual Temperature Compensation Method

Mode-localized pressure sensors have the advantage of high sensitivity and resolution, making them being widely studied. However, they also suffer from the influence of temperature fluctuations due to the thermal stress, but compensation method has not been explored. This study proposes a mode-localized pressure sensor with dual temperature compensation. The temperature dependence of the output signal and the compensation method is elucidated. Both passive and active methods are considered, as passive methods typically serve as the foundation for attaining an efficient active compensation outcome. Consequently, the sensor is packaged using low-stress bonding techniques, specifically Au-Si eutectic bonding. On the basis of the passive compensation, electrostatic forces are also employed to further mitigate the errors in amplitude ratio output induced by thermal stress. This approach effectively decouples the output signal from temperature. The sensor was tested from −20 °C to 60 °C, and the results show the feasibility and advantages of the proposed compensation method.