Enhancement of Ferroelectricity in Hf <sub>0.5</sub> Zr <sub>0.5</sub> O <sub>2</sub> via Pre-Crystallization and Interface Engineering at Ultra-Low Temperature (300 °C) Annealing
The interface degradation between ferroelectric film and surrounding layers limits the endurance of hafnia ferroelectric devices significantly. This letter proposes a promising TiN/TZHZT/TiN structure with TiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub>/ZrO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bi-interlayers on both sides of a sub-7 nm Hf<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.5</sub>Zr<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.5</sub>O<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> (HZO). The TZHZT sample underwent ultra-low temperature annealing at 300 °C demonstrates exceptional ferroelectric properties, <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i.e.</i> significant remnant polarization (2<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">P<sub>r</sub></i>=28.2 μC/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>), appropriate coercive field (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">E<sub>c</sub></i>=1.7 MV/cm), and excellent endurance exceeding 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">10</sup> cycles. Achieved results are attributed to the synergistic effects of dual interlayer engineering. Specifically, the ZrO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> interlayer promotes the growth of ferroelectric grains through the formation of seed crystals, leading to larger grain size after annealing. Meanwhile, the TiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> interlayer enhances tensile stress and oxygen enrichment, thereby improving both 2<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">P<sub>r</sub></i> and endurance. Moreover, the ZrO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> interlayer effectively compensates the deficiency of breakdown strength for TiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> layer.
Authors
- Shuai Yang (ORCID: https://orcid.org/0000-0002-6089-7628)
- Xu Chen (ORCID: https://orcid.org/0009-0004-7207-3652)
- Binbin Xu (ORCID: https://orcid.org/0000-0002-0822-5250)
- Jing Xu (ORCID: https://orcid.org/0000-0003-0062-5724)
- Xiaolei Wang (ORCID: https://orcid.org/0000-0001-9431-0058)
- Jun Luo (ORCID: https://orcid.org/0000-0002-5122-6806)
- Bohan Chen (ORCID: https://orcid.org/0009-0002-5703-8248)
- Keyou Tong
Institutions
- Chinese Academy of Sciences (CN)
- Institute of Microelectronics (CN)
Publication Details
- Journal
- IEEE Electron Device Letters
- Published
- 2025-04-22
- DOI
- https://doi.org/10.1109/led.2025.3563376
- Citations
- 1
- Primary Topic
- Ferroelectric and Negative Capacitance Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.73