Enhancement of Ferroelectricity in Hf <sub>0.5</sub> Zr <sub>0.5</sub> O <sub>2</sub> via Pre-Crystallization and Interface Engineering at Ultra-Low Temperature (300 °C) Annealing

The interface degradation between ferroelectric film and surrounding layers limits the endurance of hafnia ferroelectric devices significantly. This letter proposes a promising TiN/TZHZT/TiN structure with TiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub>/ZrO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bi-interlayers on both sides of a sub-7 nm Hf<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.5</sub>Zr<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.5</sub>O<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> (HZO). The TZHZT sample underwent ultra-low temperature annealing at 300 °C demonstrates exceptional ferroelectric properties, <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i.e.</i> significant remnant polarization (2<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">P<sub>r</sub></i>=28.2 μC/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>), appropriate coercive field (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">E<sub>c</sub></i>=1.7 MV/cm), and excellent endurance exceeding 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">10</sup> cycles. Achieved results are attributed to the synergistic effects of dual interlayer engineering. Specifically, the ZrO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> interlayer promotes the growth of ferroelectric grains through the formation of seed crystals, leading to larger grain size after annealing. Meanwhile, the TiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> interlayer enhances tensile stress and oxygen enrichment, thereby improving both 2<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">P<sub>r</sub></i> and endurance. Moreover, the ZrO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> interlayer effectively compensates the deficiency of breakdown strength for TiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> layer.

Authors

Institutions

Publication Details

Journal
IEEE Electron Device Letters
Published
2025-04-22
DOI
https://doi.org/10.1109/led.2025.3563376
Citations
1
Primary Topic
Ferroelectric and Negative Capacitance Devices
Type
article
Field-Weighted Citation Impact
0.73
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Enhancement of Ferroelectricity in Hf 0.5 Zr 0.5 O 2 via Pre-Crystallization and Interface Engineering at Ultra-Low Temperature (300 °C) Annealing

Shuai Yang, Xu Chen, Binbin Xu, Jing Xu et al.
1 citations
IEEE Electron Device Letters
Ferroelectric and Negative Capacitance Devices
0.73
article

Enhancement of Ferroelectricity in Hf 0.5 Zr 0.5 O 2 via Pre-Crystallization and Interface Engineering at Ultra-Low Temperature (300 °C) Annealing

Shuai Yang, Xu Chen, Binbin Xu, Jing Xu, Xiaolei Wang, Jun Luo, Bohan Chen, Keyou Tong
article en
1 citations

Abstract

The interface degradation between ferroelectric film and surrounding layers limits the endurance of hafnia ferroelectric devices significantly. This letter proposes a promising TiN/TZHZT/TiN structure with TiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub>/ZrO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bi-interlayers on both sides of a sub-7 nm Hf<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.5</sub>Zr<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.5</sub>O<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> (HZO). The TZHZT sample underwent ultra-low temperature annealing at 300 °C demonstrates exceptional ferroelectric properties, <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i.e.</i> significant remnant polarization (2<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">P<sub>r</sub></i>=28.2 μC/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>), appropriate coercive field (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">E<sub>c</sub></i>=1.7 MV/cm), and excellent endurance exceeding 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">10</sup> cycles. Achieved results are attributed to the synergistic effects of dual interlayer engineering. Specifically, the ZrO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> interlayer promotes the growth of ferroelectric grains through the formation of seed crystals, leading to larger grain size after annealing. Meanwhile, the TiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> interlayer enhances tensile stress and oxygen enrichment, thereby improving both 2<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">P<sub>r</sub></i> and endurance. Moreover, the ZrO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> interlayer effectively compensates the deficiency of breakdown strength for TiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> layer.

IEEE Electron Device LettersVol. 46(6)
Chinese Academy of Sciences (CN), Institute of Microelectronics (CN)
Openalex Percentile: Top 29%
Ferroelectric and Negative Capacitance Devices
0.73
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.