Investigations Into Failure Mechanism of Cascode GaN HEMTs Under Single Pulse Surge Current Stress

When Cascode gallium nitride (GaN) high-electron-mobility transistors (HEMTs) operate in the third quadrant, the surge current capability becomes one of the key parameters for practical applications. In this article, the failure behavior and mechanism of a 650 V Cascode GaN HEMT under single-pulse surge current stress are investigated. Comparative experimental results demonstrate that the irreversible failure occurs in the depletion-mode (D-mode) GaN HEMT, driven by high surge current and its resultant increasing surge voltage. Further physical failure analysis localized the failure point around the drain electrode. Moreover, by mixed-mode simulations, it is validated that joule heat accumulates rapidly around the drain electrode and eventually causes the device to burn out. Besides, it is proved that better heat dissipation for drain metal pads of devices improves the surge current capability, which provides an easy-to implement optimization for Cascode GaN HEMTs when operating in the third quadrant.

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Publication Details

Journal
IEEE Transactions on Electron Devices
Published
2025-04-22
DOI
https://doi.org/10.1109/ted.2025.3560275
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.00

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article

Investigations Into Failure Mechanism of Cascode GaN HEMTs Under Single Pulse Surge Current Stress

Jie Ma, Jiaxing Wei, Ran Ye, Yanfeng Ma et al.
IEEE Transactions on Electron Devices
GaN-based semiconductor devices and materials
article

Investigations Into Failure Mechanism of Cascode GaN HEMTs Under Single Pulse Surge Current Stress

Jie Ma, Jiaxing Wei, Ran Ye, Yanfeng Ma, Sheng Li, Long Zhang, Chi Zhang, Siyang Liu, Mingfei Li, Weifeng Sun, Weihao Lu, Weixiong Mao
article en

Abstract

When Cascode gallium nitride (GaN) high-electron-mobility transistors (HEMTs) operate in the third quadrant, the surge current capability becomes one of the key parameters for practical applications. In this article, the failure behavior and mechanism of a 650 V Cascode GaN HEMT under single-pulse surge current stress are investigated. Comparative experimental results demonstrate that the irreversible failure occurs in the depletion-mode (D-mode) GaN HEMT, driven by high surge current and its resultant increasing surge voltage. Further physical failure analysis localized the failure point around the drain electrode. Moreover, by mixed-mode simulations, it is validated that joule heat accumulates rapidly around the drain electrode and eventually causes the device to burn out. Besides, it is proved that better heat dissipation for drain metal pads of devices improves the surge current capability, which provides an easy-to implement optimization for Cascode GaN HEMTs when operating in the third quadrant.

IEEE Transactions on Electron DevicesVol. 72(6)
WuXi AppTec (China) (CN), Southeast University (CN), United Microelectronics (United States) (US)
National Natural Science Foundation of China, China Postdoctoral Science Foundation, Natural Science Foundation of Jiangsu Province
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Openalex Percentile: Top 95%
GaN-based semiconductor devices and materials
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