3D interconnects and III-V semiconductor plasma etching for low cost and high efficiency photonic devices

In this work, we fabricated multijunction solar cells with 3D interconnects to transfer the front side contact to the rear side. Anisotropic and low-damage III-V semiconductor plasma etching processes are characterized and discussed in order to realize the new contact architecture. 3D interconnected solar cells are successfully fabricated and they reduce shading losses from a standard 5-20% to just 3%. This new architecture achieves a 6-fold increase in wafer area use when compared to miniaturized solar cells with conventional connections, thanks to the via contacts and plasma dicing. 3D interconnects also enable photonic power devices with areas 3 orders of magnitude smaller than standard devices for Internet of Things applications. The new photovoltaic cell architecture will enhance the power yield per wafer while enabling low-cost miniaturized devices for applications such as photovoltaics and power over fiber.

Authors

Institutions

Publication Details

Published
2025-04-22
DOI
https://doi.org/10.1117/12.3055229
Primary Topic
Semiconductor Lasers and Optical Devices
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

3D interconnects and III-V semiconductor plasma etching for low cost and high efficiency photonic devices

Abdelatif Jaouad, Karin Hinzer, Thomas Bidaud, Christopher E. Valdivia et al.
Semiconductor Lasers and Optical Devices
article

3D interconnects and III-V semiconductor plasma etching for low cost and high efficiency photonic devices

Abdelatif Jaouad, Karin Hinzer, Thomas Bidaud, Christopher E. Valdivia, Alison Clarke, Guillaume Gay, Camille Petit‐Etienne, Mathieu de Lafontaine, Artur Turala, Maxime Darnon, Simon Fafard, Erwine Pargon, V. Aimez
article en

Abstract

In this work, we fabricated multijunction solar cells with 3D interconnects to transfer the front side contact to the rear side. Anisotropic and low-damage III-V semiconductor plasma etching processes are characterized and discussed in order to realize the new contact architecture. 3D interconnected solar cells are successfully fabricated and they reduce shading losses from a standard 5-20% to just 3%. This new architecture achieves a 6-fold increase in wafer area use when compared to miniaturized solar cells with conventional connections, thanks to the via contacts and plasma dicing. 3D interconnects also enable photonic power devices with areas 3 orders of magnitude smaller than standard devices for Internet of Things applications. The new photovoltaic cell architecture will enhance the power yield per wafer while enabling low-cost miniaturized devices for applications such as photovoltaics and power over fiber.

Centre National de la Recherche Scientifique (FR), Université de Sherbrooke (CA), University of Ottawa (CA), Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR), CEA Grenoble (FR), Laboratoire d'Électronique des Technologies de l'Information (FR), Université Grenoble Alpes (FR)
Affordable and clean energy
Openalex Percentile: Top 94%
Semiconductor Lasers and Optical Devices
DOISourceOpenAlex
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.